Breaking News
Comments
Newest First | Oldest First | Threaded View
Kinnar
User Rank
Author
re: Analysts start Intel Ivy Bridge CPU teardown
Kinnar   4/16/2012 11:34:36 AM
NO RATINGS
Intel has gone a way beyond the other are trying, that too with a new 3D connections technique, this will let then achieve the power saving standards compared to their immediate rivals. UBM's initiative lets the world know about what actually is happening inside the chips.

elctrnx_lyf
User Rank
Author
re: Analysts start Intel Ivy Bridge CPU teardown
elctrnx_lyf   4/16/2012 8:23:57 AM
NO RATINGS
Why does UBM wants to do this tear down of the chip? Will this information be useful for any other manufacturers. Anyways I would like to read the complete report if I get a chance.

resistion
User Rank
Author
re: Analysts start Intel Ivy Bridge CPU teardown
resistion   4/13/2012 12:40:48 AM
NO RATINGS
If you look at the gates and diffusion contacts together, it really does look like a 20-22 nm half-pitch that is double-patterned.

KarlFredrik
User Rank
Author
re: Analysts start Intel Ivy Bridge CPU teardown
KarlFredrik   4/12/2012 12:50:45 PM
NO RATINGS
As far as I know, Intel is still using ordinary wafers, which implies a 4-terminal device. FD-SOI is 3-terminal and I guess that's coming sooner or later (SOITEC ftw!).

US Made
User Rank
Author
re: Analysts start Intel Ivy Bridge CPU teardown
US Made   4/12/2012 12:16:42 AM
NO RATINGS
Can you pls. comment on if these are 3 terminal or 4 terminal FinFets



Radio
LATEST ARCHIVED BROADCAST

What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.

Brought to you by:

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
Most Recent Comments
Erhan.Ercan
 
Max The Magnificent
 
Tim_EE
 
elizabethsimon
 
JamesM951
 
DeeJee0
 
R_Colin_Johnson
 
sranje
 
pseudoid
Like Us on Facebook
Special Video Section
With design sizes expected to increase by 5X through 2020, ...
01:48
Linear Technology’s LT8330 and LT8331, two Low Quiescent ...
The quality and reliability of Mill-Max's two-piece ...
LED lighting is an important feature in today’s and future ...
05:27
The LT8602 has two high voltage buck regulators with an ...
05:18
Silego Technology’s highly versatile Mixed-signal GreenPAK ...
The quality and reliability of Mill-Max's two-piece ...
01:34
Why the multicopter? It has every thing in it. 58 of ...
Security is important in all parts of the IoT chain, ...
Infineon explains their philosophy and why the multicopter ...
The LTC4282 Hot SwapTM controller allows a board to be ...
This video highlights the Zynq® UltraScale+™ MPSoC, and sho...
Homeowners may soon be able to store the energy generated ...
The LTC®6363 is a low power, low noise, fully differential ...
See the Virtex® UltraScale+™ FPGA with 32.75G backplane ...
Vincent Ching, applications engineer at Avago Technologies, ...
The LT®6375 is a unity-gain difference amplifier which ...
The LTC®4015 is a complete synchronous buck controller/ ...
10:35
The LTC®2983 measures a wide variety of temperature sensors ...
The LTC®3886 is a dual PolyPhase DC/DC synchronous ...