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re: Analysts start Intel Ivy Bridge CPU teardown
Kinnar   4/16/2012 11:34:36 AM
Intel has gone a way beyond the other are trying, that too with a new 3D connections technique, this will let then achieve the power saving standards compared to their immediate rivals. UBM's initiative lets the world know about what actually is happening inside the chips.

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re: Analysts start Intel Ivy Bridge CPU teardown
elctrnx_lyf   4/16/2012 8:23:57 AM
Why does UBM wants to do this tear down of the chip? Will this information be useful for any other manufacturers. Anyways I would like to read the complete report if I get a chance.

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re: Analysts start Intel Ivy Bridge CPU teardown
resistion   4/13/2012 12:40:48 AM
If you look at the gates and diffusion contacts together, it really does look like a 20-22 nm half-pitch that is double-patterned.

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re: Analysts start Intel Ivy Bridge CPU teardown
KarlFredrik   4/12/2012 12:50:45 PM
As far as I know, Intel is still using ordinary wafers, which implies a 4-terminal device. FD-SOI is 3-terminal and I guess that's coming sooner or later (SOITEC ftw!).

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re: Analysts start Intel Ivy Bridge CPU teardown
US Made   4/12/2012 12:16:42 AM
Can you pls. comment on if these are 3 terminal or 4 terminal FinFets

In conjunction with unveiling of EE Times’ Silicon 60 list, journalist & Silicon 60 researcher Peter Clarke hosts a conversation on startups in the electronics industry. One of Silicon Valley's great contributions to the world has been the demonstration of how the application of entrepreneurship and venture capital to electronics and semiconductor hardware can create wealth with developments in semiconductors, displays, design automation, MEMS and across the breadth of hardware developments. But in recent years concerns have been raised that traditional venture capital has turned its back on hardware-related startups in favor of software and Internet applications and services. Panelists from incubators join Peter Clarke in debate.
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