Seems like an academic exercise than an effort that can result in production-ready technologies. I have nothing against PhD's (I am one myself!) but the effort in 3D IC stacking is more a stack design and manufacturing process validation exercise that needs to be conducted with close cooperation of foundries and OSATs.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.