If you take a fat unfit person (like me) and tie the latest carbon fibre running shoes on my feet it won't help. An athlete with boots on will still run faster.
The same goes for CPUs.
Intel might be ahead in process, but that does not give them a lead overall because their architecture is so terrible.
ARM stuff is still better for most applications even when built on older (and thus cheaper) fab technologies.
At the launch of Ivy Bridge ( 22 nm finFET ) last week the offical Intel claim was 20 % higher performance for 20 % lower power. Would that be good enough to scare established Fabless providers of SoCs for Mobiles to abandon their generic ARM based design / Foundry / high mark - up model and switch to X86 ? Is Intel prepared to also offer some price cuts to get a design win into SmartPhone / Tablets?
Let's not be naive: of course Intel won't praise the fabless model!
Everybody claim to have the best approach, and it's no surprise that other foundries claim 3D is not required before 14nm (going further: "you see? Intel is wasting so much money just to show off and try to justify their IDM approach!")
I'll be convinced about all of that when I'll see Intel's procs outperforming all their competitors.
Beside, if I was Intel, I'd be more careful about these claims, because we don't know how long they'll be able to compete alone in the Moore's law race...
Very interesting, but over the years the number of times we see one company thinking they have a large headstart over others is legion and even more so the number of times they find that the others can come up with other ways to do the same thing. One of the most interesting was something many may remember called "micro-channel" back in the 90's. Everybody else just came up with another way to accomplish the same thing. I suspect we'll see the same here.
It would seems that Mark statement should be taken far more seriously !Lets recall the recent NVIDIA bashing of TSMC - see my recent blog: "Is NVIDIA in a Panic? If so, what about AMD? Other fabless companies?"
Clearly Intel have significant advantage these days by being able to control the design, the EDA and Libraries and the fab.For the fabless module to work the largest fabless companies need to establish partnership with the EDA/Libraries provider and the foundry.But this will be very hard to do.
Alternatively they can change the game (to monolithic 3D IC ;-)
The fabless model will continue to function but not at the leading edge. As EUV/X-ray continues to be endlessly strung out, stretching optical will require ever more magical DFM (remember DFM?) tricks and spaceless links between design and manufacturing. The foundries will cling to their guns, bibles and recipes, while fabless designers will be forced to innovate with sub-leading edge processes.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.