Design Con 2015
Breaking News
Comments
Newest First | Oldest First | Threaded View
Page 1 / 2   >   >>
EDA360 Insider
User Rank
Rookie
re: Driving a stake into the heart of the 3-D packaging hype
EDA360 Insider   5/14/2012 10:54:44 PM
NO RATINGS
Someone had better clue IBM to the hype factor. IBM Fellow Dr. Subramanian Iyer was showing cross sections of 32nm chips with 11 layers of metal, deep-trench capacitors for eDRAM, and TSVs at the recent GSA Silicon Summit. Mr. Hassan's article repeats all of the same arguments used more than 20 years ago to explain why surface-mount technology was doomed: can't rework the boards with a soldering iron, can't test the boards with through-hole testers, JTAG costs too much to add to chips, blah, blah, blah. That dismal prediction of failure seems to have been wrong. There are too many technical advantages and too few disadvantages at this point for 3D IC assembly not to take off. Rather than labeling technical analyses as "hype" and "wishful thinking," how about a more fact-based argument to counter the technical advantages and the obvious, displayed progress by companies such as IBM and Xilinx?

EDA360 Insider
User Rank
Rookie
re: Driving a stake into the heart of the 3-D packaging hype
EDA360 Insider   5/14/2012 9:39:32 PM
NO RATINGS
The Raspberry Pi board uses a standard Broadcom BCM2835 SoC with POP (package-on-package)mounted DRAM. Nevertheless, every mobile phone handset out there already uses a 3D IC stack with wirebonding and has for years. So we're just talking a difference in interconnect here, as well as deciding who is responsible for and gets paid for a working 3D stack.

resistion
User Rank
CEO
re: Driving a stake into the heart of the 3-D packaging hype
resistion   5/13/2012 1:00:28 AM
NO RATINGS
I think TSV is going to become another expensive set of processes in the fab just like lithography. But the packaging houses and motherboard makers could get affected.

simpletrading758
User Rank
Rookie
re: Driving a stake into the heart of the 3-D packaging hype
simpletrading758   5/12/2012 5:09:06 AM
NO RATINGS
=== http://www.simpletrading.org/ thank you!!! Believe you will love it. We have good reputation, fashion products, come here quickly== http://www.simpletrading.org/

simpletrading758
User Rank
Rookie
re: Driving a stake into the heart of the 3-D packaging hype
simpletrading758   5/12/2012 5:08:45 AM
NO RATINGS
=== http://www.simpletrading.org/ thank you!!! Believe you will love it. We have good reputation, fashion products, come here quickly== http://www.simpletrading.org/

simpletrading758
User Rank
Rookie
re: Driving a stake into the heart of the 3-D packaging hype
simpletrading758   5/12/2012 5:08:28 AM
NO RATINGS
very good website: === http://www.simpletrading.org/ The website wholesale for many kinds of fashion shoes, like the nike, jordan, prada, also including the jeans, shirts, bags, hat and the decorations. All the products are free shipping, and the the price is competitive, and also can accept the paypal payment., After the payment, can ship within short time. We will give you a discount WE ACCEPT PYAPAL PAYMENT YOU MUST NOT MISS IT!!!

resistion
User Rank
CEO
re: Driving a stake into the heart of the 3-D packaging hype
resistion   5/12/2012 4:18:23 AM
NO RATINGS
Thermal is the most effective stake in the heart of 3DIC. Or the superthin dies.

rick merritt
User Rank
Author
re: Driving a stake into the heart of the 3-D packaging hype
rick merritt   5/12/2012 1:01:40 AM
NO RATINGS
This is an interesting analysis, but I have to say its more than the memory guys waiving the 3-D IC flag these days. It's big logic and fab folks like Altera, IBM, Qualcomm, TSMC, Xilinx and others. Are they all drinking the Kool-Aid?

chipmonk0
User Rank
Manager
re: Driving a stake into the heart of the 3-D packaging hype
chipmonk0   5/11/2012 8:34:34 PM
NO RATINGS
"..But alas, today's module is tomorrow's much lower cost IC. ..". So true in the past but the 3D proponents are just hoping that Moores's Law will finally grind down if not for device fundamentals ( leakage ) then at least for lithography ( EUV ) or just the min. order size needed to justify a $ 10 billon Fab

selinz
User Rank
CEO
re: Driving a stake into the heart of the 3-D packaging hype
selinz   5/10/2012 9:44:05 PM
NO RATINGS
I see most of the KGD work happening at the IDMs and most of the 3d packaging happening in conjunction with the packaging houses. The package (and sometimes test) houses will pretty much follow whatever the IDM's push but most packaging houses that I've seen don't really have much advanced test technology. This is likely to change as some of the bigger boys (like AMD) go more fabless. And to address another point, there is speed testing done at wafer level, particularly by captive processor module companies who don't want to throw away expensive chips. But alas, today's module is tomorrow's much lower cost IC.

Page 1 / 2   >   >>


Flash Poll
Top Comments of the Week
Like Us on Facebook
EE Times on Twitter
EE Times Twitter Feed

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
EE Life
Frankenstein's Fix, Teardowns, Sideshows, Design Contests, Reader Content & More
Max Maxfield

Want to Present a Paper at ESC Boston 2015?
Max Maxfield
8 comments
I tell you, I need more hours in each day. If I was having any more fun, there would have to be two of me to handle it all. For example, I just heard that I'm going to be both a speaker ...

Martin Rowe

No 2014 Punkin Chunkin, What Will You Do?
Martin Rowe
Post a comment
American Thanksgiving is next week, and while some people watch (American) football all day, the real competition on TV has become Punkin Chunkin. But there will be no Punkin Chunkin on TV ...

Rich Quinnell

Making the Grade in Industrial Design
Rich Quinnell
12 comments
As every developer knows, there are the paper specifications for a product design, and then there are the real requirements. The paper specs are dry, bland, and rigidly numeric, making ...

Martin Rowe

Book Review: Controlling Radiated Emissions by Design
Martin Rowe
1 Comment
Controlling Radiated Emissions by Design, Third Edition, by Michel Mardiguian. Contributions by Donald L. Sweeney and Roger Swanberg. List price: $89.99 (e-book), $119 (hardcover).