It begs the question, "Will UMC experience 'capacity issues' as they begin to ramp these design wins in a fashion similar to what TSMC saw?" Seems like perhaps UMC is spending more on 28nm now to address this potential issue in the same way TSMC upped their spend. Sure the processes are not all the same, but there will still be alot of similar issues.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.