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Dave.Dykstra
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re: TI says copper wire bonding momentum growing
Dave.Dykstra   5/23/2012 7:04:00 PM
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More options to help us move from the use of more precious metals are greatly needed so this one is very welcome. And since it has some apparent cost benefit (just how much is not given in the article), the end result should hopefully be some economic benefit all the way through the chain to the consumer.

RockZ
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re: TI says copper wire bonding momentum growing
RockZ   5/24/2012 12:57:15 AM
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I wonder how many of the 6.5B units made it to aviation/military/automotive applications?

wilber_xbox
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re: TI says copper wire bonding momentum growing
wilber_xbox   5/26/2012 6:06:46 PM
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i think that i share the same opinion that what percentage of the copper wire bond went to mission critical chips and high performance chips given the advantages specified in here of Cu over Au.



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As data rates begin to move beyond 25 Gbps channels, new problems arise. Getting to 50 Gbps channels might not be possible with the traditional NRZ (2-level) signaling. PAM4 lets data rates double with only a small increase in channel bandwidth by sending two bits per symbol. But, it brings new measurement and analysis problems. Signal integrity sage Ransom Stephens will explain how PAM4 differs from NRZ and what to expect in design, measurement, and signal analysis.

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