It is indeed great to see Spansion in the NAND business. SLC memory at less aggressive lithographies to focus on the reliability and lifetime demands of embedded applications is a welcome addition to the marketplace.
It is great to have Spansion in the NAND business. We are currently using a Samsung device with two 4Gb dies in a TSOP package (with one CE), but are very concerned about obsolescence. We've run into issues in the past too with EOLs on 512 Mb and 1 Gb NAND. Does anyone know if the 8 Gb device is monolithic or dual die?
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.