It is indeed great to see Spansion in the NAND business. SLC memory at less aggressive lithographies to focus on the reliability and lifetime demands of embedded applications is a welcome addition to the marketplace.
It is great to have Spansion in the NAND business. We are currently using a Samsung device with two 4Gb dies in a TSOP package (with one CE), but are very concerned about obsolescence. We've run into issues in the past too with EOLs on 512 Mb and 1 Gb NAND. Does anyone know if the 8 Gb device is monolithic or dual die?
Replay available now: A handful of emerging network technologies are competing to be the preferred wide-area connection for the Internet of Things. All claim lower costs and power use than cellular but none have wide deployment yet. Listen in as proponents of leading contenders make their case to be the metro or national IoT network of the future. Rick Merritt, EE Times Silicon Valley Bureau Chief, moderators this discussion. Join in and ask his guests questions.