It is indeed great to see Spansion in the NAND business. SLC memory at less aggressive lithographies to focus on the reliability and lifetime demands of embedded applications is a welcome addition to the marketplace.
It is great to have Spansion in the NAND business. We are currently using a Samsung device with two 4Gb dies in a TSOP package (with one CE), but are very concerned about obsolescence. We've run into issues in the past too with EOLs on 512 Mb and 1 Gb NAND. Does anyone know if the 8 Gb device is monolithic or dual die?