It is indeed great to see Spansion in the NAND business. SLC memory at less aggressive lithographies to focus on the reliability and lifetime demands of embedded applications is a welcome addition to the marketplace.
It is great to have Spansion in the NAND business. We are currently using a Samsung device with two 4Gb dies in a TSOP package (with one CE), but are very concerned about obsolescence. We've run into issues in the past too with EOLs on 512 Mb and 1 Gb NAND. Does anyone know if the 8 Gb device is monolithic or dual die?
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.