Embedded Systems Conference
Breaking News
Comments
Newest First | Oldest First | Threaded View
docdivakar
User Rank
Author
re: Opinion: What will change on the road to 3D ICs?
docdivakar   6/22/2012 8:53:25 PM
NO RATINGS
@DickH: this of course depends on the application. For memory and logic, 3 die stacks are quite common and I have also come across 5 dice stacked. You may want to look up Micron's Hypercube. MP Divakar

docdivakar
User Rank
Author
re: Opinion: What will change on the road to 3D ICs?
docdivakar   6/22/2012 8:51:21 PM
NO RATINGS
The author correctly points out the likely scenarios where heterogeneous integration (with disparate technology dice) will lead as opposed to homogeneous logic partitioned across multiple dice. There have been already memory products announced by Samsung and Micron (Hypercube). For homogeneous logic partitioned across multiple dice, in addition to the advantage mentioned, there are another compelling reasons to do so: -chip to chip interconnection where routing on the board and the number of interconnects makes it virtually impossible, leaving stacking in 3D or 2.5D as the only alternative. There are plenty of application scenarios in high speed networking. -real estate space in XY for mobiles and handhelds is another reason where homogeneous logic may have to be partitioned across multiple substrates. MP Divakar

resistion
User Rank
Author
re: Opinion: What will change on the road to 3D ICs?
resistion   6/3/2012 7:14:03 PM
NO RATINGS
Thus 2.5D came to "rescue" by avoiding that question. Yeah heat sinks don't work if you have heat sources that are closer.

DickH
User Rank
Author
re: Opinion: What will change on the road to 3D ICs?
DickH   6/3/2012 7:41:42 AM
NO RATINGS
thermal management challenges? aye, there's the rub... how many chips can you stack before the 'middle' melts?



Radio
LATEST ARCHIVED BROADCAST
Overview: Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.
Top Comments of the Week
Flash Poll
Like Us on Facebook

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
Special Video Section
LED lighting is an important feature in today’s and future ...
Active balancing of series connected battery stacks exists ...
After a four-year absence, Infineon returns to Mobile World ...
A laptop’s 65-watt adapter can be made 6 times smaller and ...
An industry network should have device and data security at ...
The LTC2975 is a four-channel PMBus Power System Manager ...
In this video, a new high speed CMOS output comparator ...
The LT8640 is a 42V, 5A synchronous step-down regulator ...
The LTC2000 high-speed DAC has low noise and excellent ...
How do you protect the load and ensure output continues to ...
General-purpose DACs have applications in instrumentation, ...
Linear Technology demonstrates its latest measurement ...
10:29
Demos from Maxim Integrated at Electronica 2014 show ...
Bosch CEO Stefan Finkbeiner shows off latest combo and ...
STMicroelectronics demoed this simple gesture control ...
Keysight shows you what signals lurk in real-time at 510MHz ...
TE Connectivity's clear-plastic, full-size model car shows ...
Why culture makes Linear Tech a winner.
Recently formed Architects of Modern Power consortium ...
Specially modified Corvette C7 Stingray responds to ex Indy ...