ARM Expects First 14nm Tape Outs in 2013
The head of ARM's processor division said Monday at Computex that ARM chips with 20-nanometer manufacturing process will appear in products in 2013, along with the first 14nm tape outs.
Simon Segarusu, Senior Vice President of ARM, said that said that the 28nm process is currently used in mass production and production tests of the first 20nm chips is expected to begin later this year, aiming at mass producing them by 2013. Multiple 20nm test chips are already taped out, including the dual-core Cortex-A15, ARM's executive said.
The first 14nm tape out is also expected to be tested at the same period, Segarusu added.
ARM's arcitecture is generally used by foundries (Samsung, UMC, TSMC, IBM, GLOBAlfoundries) and chip companies since it is offering low-power, high-performance chips that can be used in mobile, CE devices of even servers.
ARM hopes that it will gain a 20% of the server market by 2015.
Companies such as Qualcomm, Texas Instruments, Nvidia and Samsung have been licensing ARM's architecture.
Are the foundries ready for 14 nm in 2013?
This is an outstanding article by a well informed and thoughtful professional. It actually confirms Intel Bohr's assertion of challenges ahead for fabless giants.
While Intel was fast to recognize the opportunity and increased the pace of nodal introduction - from two years to one year for 22nm and 14nm, Dr. Jones states that foundry nodal introductions will be slower than the historical two year pattern.
The nodal revenue distribution over time for foundries only is very informative. Is Samsung's Apple processors included or they are excluded and treated as Samsung ASICs? Note that by 2015 Apple processors units will be larger than Intel processor volume.
Interesting but somewhat predictable times ahead -- once one accepts that mobile application processors are just the same old - compute processors
Interesting article. The IDM-like relationship between design and process already exists for the biggest fabless companies, like Qualcomm, Nvidia, and AMD. Of course they can never have a seamless relationship like in a real IDM. Considering the very shaky state of the world economy, I think the projections for future fab business are much too rosy.
It seems that the partnership needs to include at least the EDA vendors and most likely the IP vendors as well. In the respect an IDM like Intel have a very significant advantage as achieving good partnership between to many stakeholders will be extremely hard to achieve. In fact Intel had already achieved few years of process lead and if anything this lead will keep on growing. We believe the best path for the foundries-fabless to win the game would be to change the court. An attractive path for such is clearly monolithic 3D. It seems the major foundries are moving toward that, by already investing heavily in 3D-IC (TSV base at this point).
Satya Kumar – Credit Suisse
Yeah. Hi, thanks for taking my question, from Credit Suisse. Eric, you talked about the 14-nanometer multiple patterning having issues. Are you referring to 14-nanometer for Logic or were you referring to foundry processes?
Our foundry processes in the following sense that foundries are having another challenge that the IDMs would not have. The challenge is that they have to deliver design rules, which are less restrictive and they have to deliver shrink factor, which is very aggressive. So, yes, my comments on 14-nanometer being a competitor to being in the first to go concerns more the foundry environment than it concerns the microprocessor environment.
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