Chipworks( also from Canada ) has been a long established reverse - engineering company and always seesms to score first. Like they were the first to publish x-section of Intel finFET and showed the sloping side walls. Just last week they posted the first application of wide I/O memory in a consumer product ( Sony Vita ). And many more. Good Luck to Techinsights. The more the merrier. Let the games begin.
Oh, doesn't this bring me back memories! Part of my diploma project at uni was reverse engineering blocks of a video chip. I spent ours of etching and photographing, watching the chip doing its little striptease under the microscope. Then, putting it all together, into a circuit. Of course, back then it was mostly about look-up tables and sprites were the bee's knees. I think the minimum line width was 4-5um on the chip and I don't quite remember but I think it had one layer of metal and one layer of poly.
Back then, my "Electronic Devices" lecturer at uni was explaining to us how semiconductor physics would break down under about 1um. In any case, lithography would hit a brick wall, for sure! :-)
Now, with 11nm around the corner and talk about feature sizes down to 5nm, I think those worries were a bit premature!
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.