Embedded Systems Conference
Breaking News
Comments
Oldest First | Newest First | Threaded View
Page 1 / 2   >   >>
Peter Clarke
User Rank
Author
re: First 450-mm fabs to ramp in 2017, says analyst
Peter Clarke   7/10/2012 5:22:06 PM
NO RATINGS
It's all up in the air BUT what is different is that this is a game for far fewer players than it was at 300-mm and that concentrates the expense in relatively few pockets. Could that make it a transition too far?

docdivakar
User Rank
Author
re: First 450-mm fabs to ramp in 2017, says analyst
docdivakar   7/10/2012 7:06:48 PM
NO RATINGS
@Dylan: the "...the transition to 450-mm wafers is inevitable..." is only true to some, not all. I believe the number will be a small one. Given this, how are the 10 wafer fab equipment suppliers fund that 80 percent of the R&D required to support the transition? Interesting forecast on the fab demography in 2017... MP Divakar

mcgrathdylan
User Rank
Author
re: First 450-mm fabs to ramp in 2017, says analyst
mcgrathdylan   7/10/2012 7:39:56 PM
NO RATINGS
Thanks MP. I agree with you, and I suspect that Bob Johnson of Gartner would agree also. There will be only a few companies that move to 450. As far as how they will fund it, I suspect that we saw an example of that yesterday, when Intel announced it would take a stake in ASML and provide additional funding for 450-mm and EUV development. This is the way I think it has to be, because the tool vendors themselves are not going to be able to afford all of the R&D on their own.

m00nshine
User Rank
Author
re: First 450-mm fabs to ramp in 2017, says analyst
m00nshine   7/11/2012 1:39:00 AM
NO RATINGS
Not sure that ASML should set the standard for all tool vendors, though I'm sure any vendor will now like to ask for upfront $$ to fund R+D. Regarding 450mm photo development, it seems we're really talking EUV. I believe there are some toolsets like implant that face significant challenges to upsize from 300mm to 450mm, but I would think that this asml example will be the exception, not the rule.

mcgrathdylan
User Rank
Author
re: First 450-mm fabs to ramp in 2017, says analyst
mcgrathdylan   7/11/2012 6:42:25 AM
NO RATINGS
I am with you. I think every tool maker would like to get money up front for 450-mm development. But I am not sure that that many are negotiating from ASML's position of strength in lithography. Sadly, in more competitive equipment markets, bearing the cost of 450-mm development may be table stakes.

Peter Clarke
User Rank
Author
re: First 450-mm fabs to ramp in 2017, says analyst
Peter Clarke   7/11/2012 2:04:13 PM
NO RATINGS
What is also interestng is what happens to 300-mm wafer fabs when the leading-edge digital logic and memory ICs are made in a very few 450-mm megafabs. History teaches that the 300-mm fabs will become the domain of More-than-Moore, trailing-edge digital, 57 varieties of analog, mixed-signal, image sensors, MEMS and so on. And most 200-mm wafer factories will probably become economically unviable if they are trying to compete with larger 300-mm wafer fabs. The result will be a complete changing of the order.

lcovey
User Rank
Author
re: First 450-mm fabs to ramp in 2017, says analyst
lcovey   7/11/2012 8:51:21 PM
NO RATINGS
And then, talking with the Cymer folks, their EUV teech will be rolling out before 450mm is ready, even on the most optimistic predictions, which could increase yields on 300mm enough to make 450mm unnecessary in the short term.

resistion
User Rank
Author
re: First 450-mm fabs to ramp in 2017, says analyst
resistion   7/12/2012 1:27:22 AM
NO RATINGS
Fewer 450 mm fabs means contingency plans are more important, like disaster planning, etc.

m00nshine
User Rank
Author
re: First 450-mm fabs to ramp in 2017, says analyst
m00nshine   7/12/2012 12:07:33 PM
NO RATINGS
Not sure I follow how EUV could increase yield

resistion
User Rank
Author
re: First 450-mm fabs to ramp in 2017, says analyst
resistion   7/14/2012 2:50:16 AM
NO RATINGS
So far, at least by appearance only, tsmc and Intel prefer 450 mm very soon, Samsung may wait. You can't have too many changes at 14 nm.

Page 1 / 2   >   >>


Radio
NEXT UPCOMING BROADCAST
IoT Network Shoot Out
July 16, 1pm EDT Thursday

Replay available now: A handful of emerging network technologies are competing to be the preferred wide-area connection for the Internet of Things. All claim lower costs and power use than cellular but none have wide deployment yet. Listen in as proponents of leading contenders make their case to be the metro or national IoT network of the future. Rick Merritt, EE Times Silicon Valley Bureau Chief, moderators this discussion. Join in and ask his guests questions.

Brought to you by

Most Recent Comments
Flash Poll
Top Comments of the Week
Like Us on Facebook

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
Special Video Section
Chwan-Jye Foo (C.J Foo), product marketing manager for ...
The LT®3752/LT3752-1 are current mode PWM controllers ...
LED lighting is an important feature in today’s and future ...
Active balancing of series connected battery stacks exists ...
After a four-year absence, Infineon returns to Mobile World ...
A laptop’s 65-watt adapter can be made 6 times smaller and ...
An industry network should have device and data security at ...
The LTC2975 is a four-channel PMBus Power System Manager ...
In this video, a new high speed CMOS output comparator ...
The LT8640 is a 42V, 5A synchronous step-down regulator ...
The LTC2000 high-speed DAC has low noise and excellent ...
How do you protect the load and ensure output continues to ...
General-purpose DACs have applications in instrumentation, ...
Linear Technology demonstrates its latest measurement ...
10:29
Demos from Maxim Integrated at Electronica 2014 show ...
Bosch CEO Stefan Finkbeiner shows off latest combo and ...
STMicroelectronics demoed this simple gesture control ...
Keysight shows you what signals lurk in real-time at 510MHz ...
TE Connectivity's clear-plastic, full-size model car shows ...
Why culture makes Linear Tech a winner.