Industry talk of EUV, 450mm, 3D finfets does not seem to be based in reality. At what cost?
Our company is still making most of our chips on 40/45 since die cost us more on 28nm due to high wafer prices, restrictive design rules, and lower 28 vs 40/45 defect and parametric yield.
It's about time industry fess up on true status of EUV. TSMC has state EUV required for a cost viable 14nm.
" Imec has been running an ASML NXE:3100 for a year now, and its higher throughput means that process development is much easier compared to the days of the old alpha demo tool (ADT). Still, “higher throughput” is a relative term. The most wafers that Imec has run through their 3100 continuously is one lot – 23 wafers – taking about five hours. Thirteen minutes per wafer is a big improvement over several hours per wafer, but still far from adequate."
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.