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Chipguy1
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CEO
re: ASML in talks with Samsung, TSMC on equity stakes
Chipguy1   7/11/2012 3:00:32 AM
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Industry talk of EUV, 450mm, 3D finfets does not seem to be based in reality. At what cost? Our company is still making most of our chips on 40/45 since die cost us more on 28nm due to high wafer prices, restrictive design rules, and lower 28 vs 40/45 defect and parametric yield.

Chipguy1
User Rank
CEO
re: ASML in talks with Samsung, TSMC on equity stakes
Chipguy1   7/11/2012 2:53:01 AM
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From http://life.lithoguru.com/ It's about time industry fess up on true status of EUV. TSMC has state EUV required for a cost viable 14nm. " Imec has been running an ASML NXE:3100 for a year now, and its higher throughput means that process development is much easier compared to the days of the old alpha demo tool (ADT). Still, “higher throughput” is a relative term. The most wafers that Imec has run through their 3100 continuously is one lot – 23 wafers – taking about five hours. Thirteen minutes per wafer is a big improvement over several hours per wafer, but still far from adequate."

resistion
User Rank
CEO
re: ASML in talks with Samsung, TSMC on equity stakes
resistion   7/11/2012 12:26:36 AM
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Are they afraid the stock shares would tank? They could have just asked for cash up front.



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