Industry talk of EUV, 450mm, 3D finfets does not seem to be based in reality. At what cost?
Our company is still making most of our chips on 40/45 since die cost us more on 28nm due to high wafer prices, restrictive design rules, and lower 28 vs 40/45 defect and parametric yield.
It's about time industry fess up on true status of EUV. TSMC has state EUV required for a cost viable 14nm.
" Imec has been running an ASML NXE:3100 for a year now, and its higher throughput means that process development is much easier compared to the days of the old alpha demo tool (ADT). Still, “higher throughput” is a relative term. The most wafers that Imec has run through their 3100 continuously is one lot – 23 wafers – taking about five hours. Thirteen minutes per wafer is a big improvement over several hours per wafer, but still far from adequate."
Drones are, in essence, flying autonomous vehicles. Pros and cons surrounding drones today might well foreshadow the debate over the development of self-driving cars. In the context of a strongly regulated aviation industry, "self-flying" drones pose a fresh challenge. How safe is it to fly drones in different environments? Should drones be required for visual line of sight – as are piloted airplanes? Join EE Times' Junko Yoshida as she moderates a panel of drone experts.