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the_floating_ gate
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re: ASML: We won't get fooled again
the_floating_ gate   7/13/2012 6:11:48 AM
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We won't get fooled again either...LOL http://www.eetimes.com/electronics-news/4217553/Report--TSMC-may-beat-Intel-to-3-D-chips

sprite0022
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re: ASML: We won't get fooled again
sprite0022   7/13/2012 2:53:53 AM
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nikon's DSLR bussiness is booming, no need to bother with litho tools. this is waste of money anyway.

mcgrathdylan
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re: ASML: We won't get fooled again
mcgrathdylan   7/12/2012 6:34:37 PM
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In my opinion, I am sure that all of the companies you mention would like to ask for money up front. I am not sure that they can. ASML holds all of the cards in litho. I am not sure any other company would be negotiating from such a position of strength.

Bruzzer
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re: ASML: We won't get fooled again
Bruzzer   7/12/2012 4:49:00 PM
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I agree Intel wants larger wafers. Racing process is increasing their number of process steps driving moore inefficiencies into their fabrication process. History shows Intel will bypass disruptive innovations at adoption stage if an alternate method is farther along its development curve; multi dice package vs. multicore dice comes to mind. Sound strategy reducing manufacturing risk this way. Especially when the moore costly solution is concealed by monopoly accounts practice. Note of interest at Semicon session Lithography: Extending Double Patterning, Industrializing EUV and Complimentary Technologies in which Borodovsky presented, is that EBEAM was seen as the compliment to 193i & Directed Self Assembly not EUV. I personally believe Intel will harvest their current lithography investment until applied science passes through innovation phase to identiy the next process commercial industrial art. Mike Bruzzone Camp Marketing

resistion
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re: ASML: We won't get fooled again
resistion   7/12/2012 9:07:35 AM
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Did ASML set a precedent for other companies? Will TEL, Applied, Nikon, Lam, KLA-Tencor, ask the same?

mcgrathdylan
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re: ASML: We won't get fooled again
mcgrathdylan   7/12/2012 8:22:29 AM
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BTW, that was meant to be "level the playing field" above.

resistion
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re: ASML: We won't get fooled again
resistion   7/12/2012 8:03:47 AM
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No support from Intel to ASML will solve EUV defects.

CityChipMan
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re: ASML: We won't get fooled again
CityChipMan   7/12/2012 7:55:32 AM
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I think ASML has a duty to shareholders to announce any (share) price sensitive information. 300mm EUV R&D is done in all but power source/throughput (?). Intel wants 450mm EUV and 450mm ArF,KrF and immersion. This is the beginning of the end for Nikon, Intels traditional lithography partner. My money is on TSMC & Samsung to follow Intel's move.

mcgrathdylan
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re: ASML: We won't get fooled again
mcgrathdylan   7/12/2012 6:30:22 AM
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Hi Mike- EUV is part of the deal. But phase one is 450. I think that is what Intel wants more. Intel's Yan Borodovsky spoke today about using complementary lithography, including 193 immersion, DSA and perhaps other technologies. But I think Intel is just trying to cover its bases. Intel still wants EUV badly. But it seems to me that the jury is still out on EUV's economic viability.

Bruzzer
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re: ASML: We won't get fooled again
Bruzzer   7/12/2012 6:21:13 AM
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No EUV? 450 press instead? No wonder, word from Semicon show floor is that Intel will harvest 193i augmented by directed self assembly. Mike Bruzzone Camp Marketing

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