Breaking News
Comments
Newest First | Oldest First | Threaded View
<<   <   Page 2 / 3   >   >>
the_floating_ gate
User Rank
Rookie
re: ASML: We won't get fooled again
the_floating_ gate   7/13/2012 6:11:48 AM
NO RATINGS
We won't get fooled again either...LOL http://www.eetimes.com/electronics-news/4217553/Report--TSMC-may-beat-Intel-to-3-D-chips

sprite0022
User Rank
Manager
re: ASML: We won't get fooled again
sprite0022   7/13/2012 2:53:53 AM
NO RATINGS
nikon's DSLR bussiness is booming, no need to bother with litho tools. this is waste of money anyway.

mcgrathdylan
User Rank
Blogger
re: ASML: We won't get fooled again
mcgrathdylan   7/12/2012 6:34:37 PM
NO RATINGS
In my opinion, I am sure that all of the companies you mention would like to ask for money up front. I am not sure that they can. ASML holds all of the cards in litho. I am not sure any other company would be negotiating from such a position of strength.

Bruzzer
User Rank
Freelancer
re: ASML: We won't get fooled again
Bruzzer   7/12/2012 4:49:00 PM
NO RATINGS
I agree Intel wants larger wafers. Racing process is increasing their number of process steps driving moore inefficiencies into their fabrication process. History shows Intel will bypass disruptive innovations at adoption stage if an alternate method is farther along its development curve; multi dice package vs. multicore dice comes to mind. Sound strategy reducing manufacturing risk this way. Especially when the moore costly solution is concealed by monopoly accounts practice. Note of interest at Semicon session Lithography: Extending Double Patterning, Industrializing EUV and Complimentary Technologies in which Borodovsky presented, is that EBEAM was seen as the compliment to 193i & Directed Self Assembly not EUV. I personally believe Intel will harvest their current lithography investment until applied science passes through innovation phase to identiy the next process commercial industrial art. Mike Bruzzone Camp Marketing

resistion
User Rank
Manager
re: ASML: We won't get fooled again
resistion   7/12/2012 9:07:35 AM
NO RATINGS
Did ASML set a precedent for other companies? Will TEL, Applied, Nikon, Lam, KLA-Tencor, ask the same?

mcgrathdylan
User Rank
Blogger
re: ASML: We won't get fooled again
mcgrathdylan   7/12/2012 8:22:29 AM
NO RATINGS
BTW, that was meant to be "level the playing field" above.

resistion
User Rank
Manager
re: ASML: We won't get fooled again
resistion   7/12/2012 8:03:47 AM
NO RATINGS
No support from Intel to ASML will solve EUV defects.

CityChipMan
User Rank
Rookie
re: ASML: We won't get fooled again
CityChipMan   7/12/2012 7:55:32 AM
NO RATINGS
I think ASML has a duty to shareholders to announce any (share) price sensitive information. 300mm EUV R&D is done in all but power source/throughput (?). Intel wants 450mm EUV and 450mm ArF,KrF and immersion. This is the beginning of the end for Nikon, Intels traditional lithography partner. My money is on TSMC & Samsung to follow Intel's move.

mcgrathdylan
User Rank
Blogger
re: ASML: We won't get fooled again
mcgrathdylan   7/12/2012 6:30:22 AM
NO RATINGS
Hi Mike- EUV is part of the deal. But phase one is 450. I think that is what Intel wants more. Intel's Yan Borodovsky spoke today about using complementary lithography, including 193 immersion, DSA and perhaps other technologies. But I think Intel is just trying to cover its bases. Intel still wants EUV badly. But it seems to me that the jury is still out on EUV's economic viability.

Bruzzer
User Rank
Freelancer
re: ASML: We won't get fooled again
Bruzzer   7/12/2012 6:21:13 AM
NO RATINGS
No EUV? 450 press instead? No wonder, word from Semicon show floor is that Intel will harvest 193i augmented by directed self assembly. Mike Bruzzone Camp Marketing

<<   <   Page 2 / 3   >   >>


Flash Poll
EE Life
Frankenstein's Fix, Teardowns, Sideshows, Design Contests, Reader Content & More
Rishabh N. Mahajani, High School Senior and Future Engineer

Future Engineers: Don’t 'Trip Up' on Your College Road Trip
Rishabh N. Mahajani, High School Senior and Future Engineer
1 Comment
A future engineer shares his impressions of a recent tour of top schools and offers advice on making the most of the time-honored tradition of the college road trip.

Max Maxfield

Juggling a Cornucopia of Projects
Max Maxfield
7 comments
I feel like I'm juggling a lot of hobby projects at the moment. The problem is that I can't juggle. Actually, that's not strictly true -- I can juggle ten fine china dinner plates, but ...

Larry Desjardin

Engineers Should Study Finance: 5 Reasons Why
Larry Desjardin
37 comments
I'm a big proponent of engineers learning financial basics. Why? Because engineers are making decisions all the time, in multiple ways. Having a good financial understanding guides these ...

Karen Field

July Cartoon Caption Contest: Let's Talk Some Trash
Karen Field
139 comments
Steve Jobs allegedly got his start by dumpster diving with the Computer Club at Homestead High in the early 1970s.

Top Comments of the Week
Like Us on Facebook
EE Times on Twitter
EE Times Twitter Feed

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)