Interesting that ASML went public on Intel while telling analysts that Samsung and TSMC have 45 days to get in on the deal at the same price.
The argument runs that ASML was obliged to go public once it had signed the deal with Intel.
But I have known public companies keep secrets while they dot the tees and cross the eyes.
Could ASML be trying a touch of high-pressure salespersonship?
Will it rebound the benefit of Nikon?
It seems to me that there is little doubt that ASML went public with this deal because a) it's a big boost for both 450 and EUV (not to mention a vote of confidence for EUV) and b) to put the heat on TSMC and Saumsun. As you say, it would be no big deal for ASML to keep at least part of this plan a secret. But ASML wants the world to know that Samsung and TSMC have a shot to get involved too.
Could this be a boost for Nikon? I think if Nikon has the ability to match ASML in either of this technologies, now is its golden opportunity to turn the tides and level the playing feel. But I don't think Nikon can do that at this point.
I have mixed feelings about this strategy. In most respects I guess it was somewhat inevitable that even ASML would want/need help with 450 mm and EUV litho, but is it one step too many down the road of industry consolidation? Are Intel, Samsung, and to a lesser extent TSMC going to be "too big to fail" at some point if they they start taking equity positions in equipment companies? Are AMAT, TEL, and other equipment companies going to follow ASMLs lead? Where does it all end?
This equity plus research funding is an interesting strategy. When your customer list is so short and development costs are so high, it makes a lot sense for both ASML and Intel. Should Samsung and TSMC join the party? That's a tougher call, now that Intel is in with both feet.
this is a desperate move by intel.
I bet the windows 8 news drive it crazy. it commands maybe 1% tablet market now, and imagine
2-3 year later 50% desktop will be intel nonrelated, with it's cost structure it's doomed.
the proliferation of 28-40nm at foundrys is making all these possible.
intel is trying to command some advantage as it used to have by doing this, oh well, this time it might not work, it just smells like kodak.
EUV is part of the deal. But phase one is 450. I think that is what Intel wants more. Intel's Yan Borodovsky spoke today about using complementary lithography, including 193 immersion, DSA and perhaps other technologies. But I think Intel is just trying to cover its bases. Intel still wants EUV badly. But it seems to me that the jury is still out on EUV's economic viability.
I think ASML has a duty to shareholders to announce any (share) price sensitive information. 300mm EUV R&D is done in all but power source/throughput (?). Intel wants 450mm EUV and 450mm ArF,KrF and immersion. This is the beginning of the end for Nikon, Intels traditional lithography partner. My money is on TSMC & Samsung to follow Intel's move.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.