Invensense always seems to be a step ahead of its competitors, introducing the world's first six-axis MEMS combo chip combining a three-axis accelerometer and three-axis gyroscope, back in 2010:
Now Invensense has upped the ante by downsizing both the size and power of its 6-axis accelerometer/gyroscope combo chip, enabling it to maintain the world's-smallest/lowest-power crowns. Here is what co-founder Daniel Goehl said to me about it: "We try to make sure that all of our newly announced MEMS chips are always a world's first."
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.