I would like to see some common high-level 'commands' that can be standardized in multi-axis devices. The control software can then quickly easily identify the event (flip, drop, etc) without using processing power.
@R_Colin_Johnson: This product certainly helps ST keep its lead over others like Bosch and InvenSense. They seem to have made progress in the packaging technology as well, as evidenced by the package size.
Invensense and Bosch have both recently announced 6-axis combo accelerometer/gyroscope chips with their own advantages, but ST still has the lion's share of the market by virtue of there track record and ability to deliver mass production quantities. By halving the size and adding two state-machines for gesture recognition, ST should be able to continue landing the big accounts like Apple.
Replay available now: A handful of emerging network technologies are competing to be the preferred wide-area connection for the Internet of Things. All claim lower costs and power use than cellular but none have wide deployment yet. Listen in as proponents of leading contenders make their case to be the metro or national IoT network of the future. Rick Merritt, EE Times Silicon Valley Bureau Chief, moderators this discussion. Join in and ask his guests questions.