Well all the first wave of NXE:3300 EUV lithography machines are for 300-mm diameter wafers but will be used for process development so I would expect them to go to the few chip companies that have an interest in carrying on with Moore's Law.
It is also the case that throughput is not so important in process R&D giving ASML a bit longer to try and get a source that will provide high-volume throughput and be suitable to put in a manufacturing line.
Replay available now: A handful of emerging network technologies are competing to be the preferred wide-area connection for the Internet of Things. All claim lower costs and power use than cellular but none have wide deployment yet. Listen in as proponents of leading contenders make their case to be the metro or national IoT network of the future. Rick Merritt, EE Times Silicon Valley Bureau Chief, moderators this discussion. Join in and ask his guests questions.