Well all the first wave of NXE:3300 EUV lithography machines are for 300-mm diameter wafers but will be used for process development so I would expect them to go to the few chip companies that have an interest in carrying on with Moore's Law.
It is also the case that throughput is not so important in process R&D giving ASML a bit longer to try and get a source that will provide high-volume throughput and be suitable to put in a manufacturing line.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.