The trouble with any scale-up solution such as this is the EUV power is a very small fraction of the total which is dominated by heat. The thermal loading at target EUV levels has not been comprehended.
Even since the article on July 9th saying they were "in talks with ASML", I haven't heard anything more about zPlasma (http://www.eetimes.com/electronics-news/4389852/EUV-startup-in-talks-with-ASML)
They believe they can have a 200W power source integrated into production equipment within four years for $5 million. Time will tell if this is actually possible, but at the very least they have a unique approach to the source problem.
This year Intel already raised the power requirement for EUV at 20 nm feature size (whatever node it is called) by a factor of several. Samsung knows the same issue for DRAM contacts at same size (shot noise). With this new awareness, the contingencies should be being accelerated in panic mode right now.
I doubt that we will see adoption of EUV as early as 2014. Even 2016 is not certain, but that's too far out to predict. My best guess is that EUV will happen eventually for a small group of companies that can justify the cost with high volumes, but there are other technologies now on the horizon that could supplant EUV or at least coexist with EUV for certain applications, or lower volumes where it would be difficult to amortize the cost of an EUV mask set.
Replay available now: A handful of emerging network technologies are competing to be the preferred wide-area connection for the Internet of Things. All claim lower costs and power use than cellular but none have wide deployment yet. Listen in as proponents of leading contenders make their case to be the metro or national IoT network of the future. Rick Merritt, EE Times Silicon Valley Bureau Chief, moderators this discussion. Join in and ask his guests questions.