The trouble with any scale-up solution such as this is the EUV power is a very small fraction of the total which is dominated by heat. The thermal loading at target EUV levels has not been comprehended.
Even since the article on July 9th saying they were "in talks with ASML", I haven't heard anything more about zPlasma (http://www.eetimes.com/electronics-news/4389852/EUV-startup-in-talks-with-ASML)
They believe they can have a 200W power source integrated into production equipment within four years for $5 million. Time will tell if this is actually possible, but at the very least they have a unique approach to the source problem.
This year Intel already raised the power requirement for EUV at 20 nm feature size (whatever node it is called) by a factor of several. Samsung knows the same issue for DRAM contacts at same size (shot noise). With this new awareness, the contingencies should be being accelerated in panic mode right now.
I doubt that we will see adoption of EUV as early as 2014. Even 2016 is not certain, but that's too far out to predict. My best guess is that EUV will happen eventually for a small group of companies that can justify the cost with high volumes, but there are other technologies now on the horizon that could supplant EUV or at least coexist with EUV for certain applications, or lower volumes where it would be difficult to amortize the cost of an EUV mask set.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.