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Stuart2121
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re: Intel upgrades 3G RF chip with power amplifiers
Stuart2121   8/1/2012 2:25:26 AM
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INVENTORS - DO NOT TRUST INTEL!!! I invented a CPU cooler - 3 times better than best - better than water. Intel have major CPU cooling problems - "Intel's microprocessors were generating so much heat that they were melting" (iht.com) - try to talk to them - they send my communications to my competitor & will not talk to me. Winners of major 'Corporate Social Responsibility' awardS!!! Huh!!!! When did RICO get repealed?" INVENTORS - DO NOT TRUST INTEL!!! BTW, I have the evidence - my competitor gave it to me. BBTW, I am prepared to apologise to Intel if; • They can show that the actions were those of a single individual in the company, acting outside corporate policy, and: • They gain redress on my behalf.

Chipguy1
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CEO
re: Intel upgrades 3G RF chip with power amplifiers
Chipguy1   7/31/2012 2:32:01 AM
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A integrated CMOS PA is significant for 3G Would set them up well to do a single chip cell phone at very low cost which would be a potent weapon to compete against Qualcomm and Spectrum in China.

Peter Clarke
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Blogger
re: Intel upgrades 3G RF chip with power amplifiers
Peter Clarke   7/30/2012 9:56:18 PM
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I can only tell you what Intel tells me and they are often skimpy on engineering information. As it says above: there is no datasheet and information is only available to special customers under NDA. But Intel definitely says it integrates power amplifiers (that is what the p stands for) and Intel says the 65-nm device is good for 3G handsets and for M2M applications. Intel executive Stefan Wolff told me the design will be manufactured by a foundry and then mentioned all of GlobalFoundries, TSMC and UMC. He has seen the story as it appeared and is happy that it says power amplifiers. I guess they could be dialed-down PAs but then there would be no logistical benefit for full handset operation, which Intel says this device brings.

rficPDX
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re: Intel upgrades 3G RF chip with power amplifiers
rficPDX   7/30/2012 9:32:40 PM
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This article is a bit curious. Integration of a 3G 65nm CMOS PA onto the transceiver is a major advance in RF functional integration. Yet the article talks more about integration of power management and sensor integration than about PAs- about which it says nothing more than mentioning the PA. Then it talks about lower cost handsets and M2M applications. Are we talking about a PA capable of full handset transmit power, or are we talking about a dialed-down output power PA? Is it possible the term "power amplifier" mistakenly got interchanged with "power management"?

Kinnar
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CEO
re: Intel upgrades 3G RF chip with power amplifiers
Kinnar   7/30/2012 3:16:54 PM
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It is rightly clicked by intel the cost effectiveness was really required for this piece inside the modem and/or portable devices. This open a all new business segment for intel.

BJ-5
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Rookie
re: Intel upgrades 3G RF chip with power amplifiers
BJ-5   7/30/2012 1:04:02 PM
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This article is a data point for Arm CEO article. http://eetimes.com/electronics-news/4391221/ARM--TSMC-lead-Intel-in-SoC--says-CEO-East Intel does have leadership for CPU but process lead means for mobile SOC is more than Moore law. Process lead in mobile is about SOC integration. PA are one of the hardest RF components to integrate in CMOS so Intel's announcement is significant. So when intel sets out to introduce this new chip it uses a foundry 65nm technology. Mr .East point was Mobile chips require higher levels of integration ( RF and power transistor being just two examples) which are not even supported today in intels 22nm finfet).

TobiasX
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Rookie
re: Intel upgrades 3G RF chip with power amplifiers
TobiasX   7/30/2012 11:21:15 AM
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Booya Qualcomm, PA in 65nm ON CHIP, suck this!



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