I don't believe there is chronic a “disconnect” between thermal management specialists and real world manufacturing the author is pointing to. Most companies I know of (including several where I worked) took into considerations the variations in material properties, assembly process (reflow & on-board thermocouple locations), were considered and bracketed for upper and lower bounds.
There is some relevance to the language issue when communicating design and assembly specs to overseas vendors.
NASA's Orion Flight Software Production Systems Manager Darrel G. Raines joins Planet Analog Editor Steve Taranovich and Embedded.com Editor Max Maxfield to talk about embedded flight software used in Orion Spacecraft, part of NASA's Mars mission. Live radio show and live chat. Get your questions ready.
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