I don't believe there is chronic a “disconnect” between thermal management specialists and real world manufacturing the author is pointing to. Most companies I know of (including several where I worked) took into considerations the variations in material properties, assembly process (reflow & on-board thermocouple locations), were considered and bracketed for upper and lower bounds.
There is some relevance to the language issue when communicating design and assembly specs to overseas vendors.
A Book For All Reasons Bernard Cole1 Comment Robert Oshana's recent book "Software Engineering for Embedded Systems (Newnes/Elsevier)," written and edited with Mark Kraeling, is a 'book for all reasons.' At almost 1,200 pages, it ...