I don't believe there is chronic a “disconnect” between thermal management specialists and real world manufacturing the author is pointing to. Most companies I know of (including several where I worked) took into considerations the variations in material properties, assembly process (reflow & on-board thermocouple locations), were considered and bracketed for upper and lower bounds.
There is some relevance to the language issue when communicating design and assembly specs to overseas vendors.
Blog Doing Math in FPGAs Tom Burke 4 comments For a recent project, I explored doing "real" (that is, non-integer) math on a Spartan 3 FPGA. FPGAs, by their nature, do integer math. That is, there's no floating-point ...