I do not know of separate fabs in Austin for flashes and logic chips, but Samsung press report says "full system LSI" production at austin fab. Remember announcement of new samsung china memory fab for flashes? Maybe Austin memory production move to china fab to make possible more profitable LSI in USA.
Great news! I know that Hynix only had a US fab to circumvent punitive duties, and as soon as the duties expired they closed the fab. Samsung seems to be taking their US operations more seriously, which is great. Hopefully Samsung will start to shift some development to the US as well.
We have heard this investment is mainly for 3D IC manufacture. According to the history of Austin Fab, maybe imply next gen processor for Apple (A7?!) would be 3D structure and Samsung may gain more market share across foundry business.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.