QCOM has contracts with TSMC, UMC and Samsung already and now they are exploring contracts with GloFo and SMIC? Why now?? Why not earlier?? Maybe Apple will follow suit - Samsung, TSMC first then UMC then GloFo then SMIC....
It's not that there are not enough fabs or money. It's technology know-hows and yielding. 28/20nm and advanced technologies are getting harder and harder to get yield up to achieve the level of economics and only TSMC, Intel and Samsung are able to demonstrate that right moment.
While TSMC was right in rejecting the offer I still feel they could have negotiated an alternate way to resolve this shortage. TSMC is reducing its silicon forecast one hand and turning the other side when the customers come asking. Or is it that their 28nm node is still not up to the mark. The smaller foundries are still long way behind as compared to TSMC and cannot offer the same economies of scale, perhaps big A should checkout the IBM shoppe.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.