Design Con 2015
Breaking News
Comments
Newest First | Oldest First | Threaded View
elektryk321
User Rank
Rookie
re: FPGA-based instrumentation withstands chill in deep space
elektryk321   9/13/2012 7:55:54 AM
NO RATINGS
High temperature makes problems with silicon devices by fast electrons movement and power dissipation. Low temperature makes no problem for silicon design itself, but for mechanical design like wiring inside package, crystal oscillators or electrical interconnects. I do not feel this mechanical problems are big deals for any other IC manufacturers.

LJL1
User Rank
Rookie
re: FPGA-based instrumentation withstands chill in deep space
LJL1   9/13/2012 6:47:09 AM
NO RATINGS
One might expect that the differential shrinking between metal and silicon would cause broken traces on the die. Can you say whether or not this may have happened?



Flash Poll
Top Comments of the Week
Like Us on Facebook
EE Times on Twitter
EE Times Twitter Feed

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
EE Life
Frankenstein's Fix, Teardowns, Sideshows, Design Contests, Reader Content & More
Max Maxfield

Want to Present a Paper at ESC Boston 2015?
Max Maxfield
7 comments
I tell you, I need more hours in each day. If I was having any more fun, there would have to be two of me to handle it all. For example, I just heard that I'm going to be both a speaker ...

Martin Rowe

No 2014 Punkin Chunkin, What Will You Do?
Martin Rowe
Post a comment
American Thanksgiving is next week, and while some people watch (American) football all day, the real competition on TV has become Punkin Chunkin. But there will be no Punkin Chunkin on TV ...

Rich Quinnell

Making the Grade in Industrial Design
Rich Quinnell
12 comments
As every developer knows, there are the paper specifications for a product design, and then there are the real requirements. The paper specs are dry, bland, and rigidly numeric, making ...

Martin Rowe

Book Review: Controlling Radiated Emissions by Design
Martin Rowe
1 Comment
Controlling Radiated Emissions by Design, Third Edition, by Michel Mardiguian. Contributions by Donald L. Sweeney and Roger Swanberg. List price: $89.99 (e-book), $119 (hardcover).