I can't think of any way that Intel's 22nm process integration is cost competitive against the foundry cost. Unless the finFET yields at the foundries are really bad ( a possibility since it would be their first generation)
Means if foundry product requires a full range of transistors (low leakage,RF, quality analog etc.) for a mobile 22nm SOC, that is not offered even for internal intel product until end of 2013. Mobile SOC intel foundry customers thus at a disadvantage compared to tsmc and other foundry.
Finally, Intel's Mr. Silicon admits Intel does not lead in silicon technology for SOC
"It’s fair to say Intel didn’t have much of a focus four or five years ago on SoCs, but that’s changed,” said Mark Bohr",
plus more at
Intel's mobile/Atom 22nm SOC in market in late 2013 is 2 years behind Foundry/ARM 28 nm shipping now (foundry 28nm and Intel's SOC 22nm has about same transistor density making it a reasonable point of comparison).
Intel's silicon group has been the biggest hindrance to getting into mobile market.
Intel's move to finFET has also been a major setback to getting into mobile market. Intel finFET SOC have been talked about for 2 years but are still another 1.5 years away from chips on market. Intel's finFET SOC is late since large delay in moving all the design IP due to issues with transistor matching, analog, RF , and I/O are all not attractive on a bulk finFET SOC vs since at total chip system level intel's 22nm finFET has negligible advantage over foundry 28nm planar transistor.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.