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green_ee
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re: Process showdown set for IEDM conference
green_ee   9/25/2012 3:55:03 PM
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22nm not cost-effective ? I suppose that depends upon the level of integration. While it's probably not a cost-savings to replace small individual 32nm devices with 22nm, there is a definite cost-savings thru higher integration at smaller process geometries to reduce PCB area, total BOM, and possibly power-savings as well.

Peter Clarke
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re: Process showdown set for IEDM conference
Peter Clarke   9/25/2012 10:00:23 AM
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@James I was not aware that Intel has a position on a "manufacturing show down" and therefore did not try to repeat it. My intention was to tell readers that papers will be presented at IEDM on many of the leading-edge process technologies that will be producing chips in the near future. And therefore San Francisco in early December would be a good place to find out more. The rigor of the IEDM review process means that these should be detailed, quantitative presentations albeit likely to be only on certain aspects of each of these processes. From my perusal of the program the 14-nm logic node is being discussed mainly by academic groups looking at aspects of doping and strain in individual transistors. To your second point. All what guys?

James7740
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re: Process showdown set for IEDM conference
James7740   9/24/2012 11:13:39 PM
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Peter, I have seen others post this as well. Can you address why repeating the intel spin on "manufacturing show down" makes any sense when today most advanced atom SOC is on 32nm and will stay that way until end of 2013 ! while Qualcomm is shipping 50M units 28nm this year in just the iPhone 5 design alone and (2) I thought all you guys were writing about intel winning mobile market with 22nm finfet last year (2011) and intel has not demo anything close to A6 CPU or graphic power/performance (at mobIle power level) .... Even demoed something close to what is already shipping !

chipguy 1
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re: Process showdown set for IEDM conference
chipguy 1   9/24/2012 7:59:24 PM
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My foundry contact has studied Intel's 22nm SOC FinFET manufacturing flow and claims that it is not cost effective (compared to foundry 28nm/32nm) to manufacture mobile chips hence even Intel over next 3 years will still make most of its Infineon mobile cell phone chipsets at TSMC. Chips such as the 2 main chips in Apple's iphone 5: MDM9615 and A6 have an average ASP of $20 compared to similar die size X86 that Intel sells for $100-200)

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