Design Con 2015
Breaking News
Comments
Newest First | Oldest First | Threaded View
Page 1 / 2   >   >>
michigan0
User Rank
CEO
re: Process showdown set for IEDM conference
michigan0   10/4/2012 3:46:26 PM
NO RATINGS
I am little confused by the title “Intel, Rivals gird for IC manufacturing showdown” because IEDM (International Electron Device Meeting) has not been a forum for IC manufacturing showdown, instead mainly for new research devices, new transistor analysis techniques, device physics, scaling limits…etc. Furthermore, among the three major technologies for 22/20 nodes, FDFinFETs by Intel, FDSOI/UTTBB by IBM Alliances and planar bulk Si by Samsung to be presented here at IEDM, Intel is the only one manufacturing its FDFinFETs for several months now. IBM and Samsung have not announced yet when their technologies will be manufacturing. Therefore, in my opinion the word manufacturability would be more appropriate than “manufacturing” because manufactrability will become the determining factor for ultimate CMOS scaling for 22/20nm nodes and beyond. In order to have manufacturability assessments the transistor electrical characteristics such as VT, dId/dVg, dId/dVd, DIBL, and SS (sub-threshold slope) should be measured, and used also as minimum criteria for paper selection. I have been attending IEDM for over ten years. The paper selection has significantly deteriorated recently as indicated by a significant number of the papers presented don’t meet the minimum criteria. Skim

I_B_GREEN
User Rank
Rookie
re: Process showdown set for IEDM conference
I_B_GREEN   9/28/2012 2:49:23 PM
NO RATINGS
So why not mix and match these techniques using the best for the type of circuits. Finfets for fast transievers with power gating when not in use. Others that do not need the speed or low power switching can be other types. I was drawing finfets in my notebook in the early 90's sitting in ee classes.

Bruzzer
User Rank
Freelancer
re: Process showdown set for IEDM conference
Bruzzer   9/27/2012 4:50:21 AM
NO RATINGS
Mike Bruzzone is fm IBM PC Board add on’s; Turbo, Memory, Network Card, 1st 2.5 D PC AT graphics card, 33 PC introductions including fastest 386 33 class workstation on memory write back; co host 1990 SIGGRAPH, first PC Standard MP C&T Corallary Chip set, first not Intel 387 math coprocessor, first not Intel 486SLC/486DLC, 486S Intel substitute microprocessors, first Nx586 replacement platform, first 16 bit bus 32 bit core Mini RISC, first 32 bit performance Mini RISC SOC, first I frame editor, first fast486120, some Alpha&NT, first low power C6 desktop & first less than $1,000 PC. Current research tracks include economics of fabrication; member Silicon Valley Round Table, intersection x86 & ARM, HPC/GPU/APU, resistive RAMs & advanced non volatile memory structures. Mike Bruzzone is an Intel competitive strategist specializing in not Intel product commercialization who is invited discovery technical assistant by Federal Trade Commission Bureau of Competition for FTC v Intel Docket 9288, lettered to work report Assistant AG Antitrust Division of the State of California Department of Justice for defining Sherman Act Section One violation, a EUCC domestic U.S point of contact Monti/Kroes/Martinez Commissions, SEC recognized Relator by letter, Federal False Claims Act Original Source by letter U.S. Attorney Northern California District, recognized Relator Intel monopoly procurement theft in fifty States, four territories and the District of Columbia, invited discovery technical assistant FTC Chairman Referral back into Bureau of Competition Docket 9341, FBI original source of Intel Dealing Cartel 1996. Criminal sub groups operating in Intel have in past positioned detractors as mentally ill, including their own employees up high in the enterprise who question Intel’s invented reality in pursuit of error correction, remedies, maintenance of democratic capitalism & industrial social responsibilities. For consultancy inquire campmkting@aol.com

chipguy 1
User Rank
Rookie
re: Process showdown set for IEDM conference
chipguy 1   9/26/2012 2:00:13 PM
NO RATINGS
PHW_#1, Confirmed--Intel baseband will use foundry (mostly TSMC) for next 2-3 years since Intel's internal cost is too high. This is because Intel's 22nm to get to yield has more restrictive design rules (increases die size). Restrictive design rules are on logic, analog, I/O, and back-end metal. Intel will never have competitive baseband chips in its 22nm SOC. Same is true for Intel's atom line, 22nm SOC Intel chip name Valleyview)...it is that part again due to the restrictive design rules that will not be competitive on cost.

rfab
User Rank
Rookie
re: Process showdown set for IEDM conference
rfab   9/26/2012 10:52:34 AM
NO RATINGS
Mike Bruzzone Should be mentally ill

Peter Clarke
User Rank
Blogger
re: Process showdown set for IEDM conference
Peter Clarke   9/26/2012 9:30:33 AM
NO RATINGS
I don't see any planned discussion of process metrology. Probably something for one of the Semicon conferences?

PHW_#1
User Rank
Rookie
re: Process showdown set for IEDM conference
PHW_#1   9/26/2012 8:13:31 AM
NO RATINGS
I hope your foundry contact is an ex-intel guy and he knows what he is comparing to. Most likely he is comparing what their FINFET will be in the COST sense. I will never doubt Intel's manufacturing cost much or significantly lower than foundry offering. Intel's biggest expense might not be in wafer manufacturing, they also need to cover IP/EDA tool development/product design teams, in addition marketing cost..... You should consider Synopsys/Candence/ARM/Virage../TSMC/SPIL/ASE../Qualcomm/nVidia.... before you start calculating the selling price. Too bad Intel can't just open its technology/manufacturing capability for design houses. You might want to check the baseband/AP SOC chips Clover Trail are made at TSMC or not? How about even 32nm SOC Medfield chip in TSMC? Who cares about legacy chips at TSMC? Also x86 atom is in the range 20x2 =40 price range. Nobody is using server chip for mobile phone. The war is getting more excited finally.

MClayton0
User Rank
CEO
re: Process showdown set for IEDM conference
MClayton0   9/26/2012 2:40:52 AM
NO RATINGS
@bruzzer is this some innovative marketing statement? Who is the client.

ANON1255185289979
User Rank
Rookie
re: Process showdown set for IEDM conference
ANON1255185289979   9/25/2012 6:03:26 PM
NO RATINGS
Will there be any discussion of planned process metrology?

Bruzzer
User Rank
Freelancer
re: Process showdown set for IEDM conference
Bruzzer   9/25/2012 4:34:47 PM
NO RATINGS
Intel cannot afford to implement beyond 20nm. SandyBridge Moble Mfg Cost $0.40 per sq mil dice area. US Government & Intel are concealing Corp. is looted by employees and stakeholders & Bankrupt in future terms. 5 Sources; 1) infiltration by cartel organized network crime; 2) banked cost constructing surplus barrier limiting competitors beyond 32 nm; 3rd, theft from stockholder’s administers cost of channel price fix tie; 4th, theft fm end customers charged price fix in invoice plus monopoly overcharges. Likely PC end buyers will see some recovery. 5th industrial theft processors dumped at price less than cost. 5 categories record $178,713,547,976 misrepresented & unreported cost burden on Intel. Where are present cost burdens? 1st, inventories Xeon Westmere EX, Aarondale, Sandy Bridge Desktop & Mobile. 3 Issues; first, surplus processors banked in channels on deferred revenue recognition; 2nd, completed systems stalled in channels showing now what is occurring inside Intel; 3rd, surplus banked goods; processors, systems, repurposed for apps that will compete against Intel future product placing burden on industry in total. Finally, one must ask why Intel is sustaining price on prior runs instead of flushing at cost to recover investment burden? For Intel to dump inventories means twin tower effect on supply chain. Processor margins eliminated AMD becomes system house to capture remaining downstream producer values. Same for other processor design producers impacted by surplus raining down. Collapse flattens Intel’s long time channel & contract manufacturers finally take over for certain. Final question was price hold a hidden condition in Docket 9341 consent agreement? It’s time for regulatory mechanisms in this country that are supposed to police monopolization, cartel and investment fraud, including at Intel, to do that job of be replaced with administrations that will do that job. Respectfully submitted, Mike Bruzzone

Page 1 / 2   >   >>


Most Recent Comments
resistion
 
resistion
 
David Ashton
 
Susan Rambo
 
AZskibum
 
AZskibum
 
alex_m1
 
alex_m1
 
AZskibum
Top Comments of the Week
Flash Poll
Like Us on Facebook

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
EE Life
Frankenstein's Fix, Teardowns, Sideshows, Design Contests, Reader Content & More
<b><a href=Betajet">

The Circle – The Future's Imperfect in the Present Tense
Betajet
5 comments
The Circle, a satirical, dystopian novel published in 2013 by San Francisco-based writer Dave Eggers, is about a large, very powerful technology company that combines aspects of Google, ...

Max Maxfield

Recommended Reads From the Engineer's Bookshelf
Max Maxfield
27 comments
I'm not sure if I read more than most folks or not, but I do I know that I spend quite a lot of time reading. I hate to be idle, so I always have a book or two somewhere about my person -- ...

Martin Rowe

Make This Engineering Museum a Reality
Martin Rowe
Post a comment
Vincent Valentine is a man on a mission. He wants to make the first house to ever have a telephone into a telephone museum. Without help, it may not happen.

Rich Quinnell

Making the Grade in Industrial Design
Rich Quinnell
16 comments
As every developer knows, there are the paper specifications for a product design, and then there are the real requirements. The paper specs are dry, bland, and rigidly numeric, making ...

Special Video Section
The LT8640 is a 42V, 5A synchronous step-down regulator ...
The LTC2000 high-speed DAC has low noise and excellent ...
How do you protect the load and ensure output continues to ...
General-purpose DACs have applications in instrumentation, ...
Linear Technology demonstrates its latest measurement ...
10:29
Demos from Maxim Integrated at Electronica 2014 show ...
Bosch CEO Stefan Finkbeiner shows off latest combo and ...
STMicroelectronics demoed this simple gesture control ...
Keysight shows you what signals lurk in real-time at 510MHz ...
TE Connectivity's clear-plastic, full-size model car shows ...
Why culture makes Linear Tech a winner.
Recently formed Architects of Modern Power consortium ...
Specially modified Corvette C7 Stingray responds to ex Indy ...
Avago’s ACPL-K30T is the first solid-state driver qualified ...
NXP launches its line of multi-gate, multifunction, ...
Doug Bailey, VP of marketing at Power Integrations, gives a ...
See how to ease software bring-up with DesignWare IP ...
DesignWare IP Prototyping Kits enable fast software ...
This video explores the LT3086, a new member of our LDO+ ...
In today’s modern electronic systems, the need for power ...