Embedded Systems Conference
Breaking News
Newest First | Oldest First | Threaded View
<<   <   Page 2 / 2
User Rank
re: Process showdown set for IEDM conference
green_ee   9/25/2012 3:55:03 PM
22nm not cost-effective ? I suppose that depends upon the level of integration. While it's probably not a cost-savings to replace small individual 32nm devices with 22nm, there is a definite cost-savings thru higher integration at smaller process geometries to reduce PCB area, total BOM, and possibly power-savings as well.

Peter Clarke
User Rank
re: Process showdown set for IEDM conference
Peter Clarke   9/25/2012 10:00:23 AM
@James I was not aware that Intel has a position on a "manufacturing show down" and therefore did not try to repeat it. My intention was to tell readers that papers will be presented at IEDM on many of the leading-edge process technologies that will be producing chips in the near future. And therefore San Francisco in early December would be a good place to find out more. The rigor of the IEDM review process means that these should be detailed, quantitative presentations albeit likely to be only on certain aspects of each of these processes. From my perusal of the program the 14-nm logic node is being discussed mainly by academic groups looking at aspects of doping and strain in individual transistors. To your second point. All what guys?

User Rank
re: Process showdown set for IEDM conference
James7740   9/24/2012 11:13:39 PM
Peter, I have seen others post this as well. Can you address why repeating the intel spin on "manufacturing show down" makes any sense when today most advanced atom SOC is on 32nm and will stay that way until end of 2013 ! while Qualcomm is shipping 50M units 28nm this year in just the iPhone 5 design alone and (2) I thought all you guys were writing about intel winning mobile market with 22nm finfet last year (2011) and intel has not demo anything close to A6 CPU or graphic power/performance (at mobIle power level) .... Even demoed something close to what is already shipping !

chipguy 1
User Rank
re: Process showdown set for IEDM conference
chipguy 1   9/24/2012 7:59:24 PM
My foundry contact has studied Intel's 22nm SOC FinFET manufacturing flow and claims that it is not cost effective (compared to foundry 28nm/32nm) to manufacture mobile chips hence even Intel over next 3 years will still make most of its Infineon mobile cell phone chipsets at TSMC. Chips such as the 2 main chips in Apple's iphone 5: MDM9615 and A6 have an average ASP of $20 compared to similar die size X86 that Intel sells for $100-200)

<<   <   Page 2 / 2

Top Comments of the Week
Like Us on Facebook

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
EE Life
Frankenstein's Fix, Teardowns, Sideshows, Design Contests, Reader Content & More
Max Maxfield

Teensy-Weensy GPAK4 Mixed Signal FPGAs
Max Maxfield
Post a comment
The vast majority of the embedded designers I know typically create MCU-based systems -- they rarely even consider using a Field-Programmable Gate Array (FPGA).

Bernard Cole

A Book For All Reasons
Bernard Cole
1 Comment
Robert Oshana's recent book "Software Engineering for Embedded Systems (Newnes/Elsevier)," written and edited with Mark Kraeling, is a 'book for all reasons.' At almost 1,200 pages, it ...

Martin Rowe

Leonard Nimoy, We'll Miss you
Martin Rowe
Like many of you, I was saddened to hear the news of Leonard Nimoy's death. His Star Trek character Mr. Spock was an inspiration to many of us who entered technical fields.

Rich Quinnell

Making the Grade in Industrial Design
Rich Quinnell
As every developer knows, there are the paper specifications for a product design, and then there are the real requirements. The paper specs are dry, bland, and rigidly numeric, making ...

Special Video Section
After a four-year absence, Infineon returns to Mobile World ...
A laptop’s 65-watt adapter can be made 6 times smaller and ...
An industry network should have device and data security at ...
The LTC2975 is a four-channel PMBus Power System Manager ...
In this video, a new high speed CMOS output comparator ...
The LT8640 is a 42V, 5A synchronous step-down regulator ...
The LTC2000 high-speed DAC has low noise and excellent ...
How do you protect the load and ensure output continues to ...
General-purpose DACs have applications in instrumentation, ...
Linear Technology demonstrates its latest measurement ...
Demos from Maxim Integrated at Electronica 2014 show ...
Bosch CEO Stefan Finkbeiner shows off latest combo and ...
STMicroelectronics demoed this simple gesture control ...
Keysight shows you what signals lurk in real-time at 510MHz ...
TE Connectivity's clear-plastic, full-size model car shows ...
Why culture makes Linear Tech a winner.
Recently formed Architects of Modern Power consortium ...
Specially modified Corvette C7 Stingray responds to ex Indy ...
Avago’s ACPL-K30T is the first solid-state driver qualified ...
NXP launches its line of multi-gate, multifunction, ...
EE Times Senior Technical Editor Martin Rowe will interview EMC engineer Kenneth Wyatt.
Flash Poll