I have seen others post this as well. Can you address why repeating the intel spin on "manufacturing show down" makes any sense when today most advanced atom SOC is on 32nm and will stay that way until end of 2013 ! while Qualcomm is shipping 50M units 28nm this year in just the iPhone 5 design alone and
(2) I thought all you guys were writing about intel winning mobile market with 22nm finfet last year (2011) and intel has not demo anything close to A6 CPU or graphic power/performance (at mobIle power level) .... Even demoed something close to what is already shipping !
My foundry contact has studied Intel's 22nm SOC FinFET manufacturing flow and claims that it is not cost effective (compared to foundry 28nm/32nm) to manufacture mobile chips hence even Intel over next 3 years will still make most of its Infineon mobile cell phone chipsets at TSMC.
Chips such as the 2 main chips in Apple's iphone 5: MDM9615 and A6 have an average ASP of $20 compared to similar die size X86 that Intel sells for $100-200)
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.