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resistion
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re: TSMC says 20 nm, 3-D are ready for design
resistion   10/14/2012 7:01:55 AM
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Well the 22 nm intel fin has been reverse- engineered and publicized, not sure if that will be copied. Indeed, 14 nm could be more interesting battleground. Still this has been worked on for some years already, not much to fumble with, maybe channel materials.

Simon7382
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re: TSMC says 20 nm, 3-D are ready for design
Simon7382   10/14/2012 4:13:15 AM
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I bet Intel has a number of patents pending on finfet technology which will make it difficult for TSMC or other fabs to copy it.

resistion
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CEO
re: TSMC says 20 nm, 3-D are ready for design
resistion   10/14/2012 12:15:24 AM
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Wonder how quickly finfet (16 nm half node) will be ready.



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