Even at 14 nm node, there will be more double patterning layers than multi-patterning layers for sure.
ASML has already said EUV would only be introduced on a few layers, allowing mix-and-match with immersion, but by that time, even the middle layers would be requiring double patterning.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.