It's not just the consolidation of a couple of equipment companies. Remember ASML invited Intel, Samsung, and TSMC to become part owners as well. So now we have everything from design through fabrication AND the equipment used to do it all intertwined together. At some point if the cost of making EUV work is so costly then maybe it's just not viable right now. Maybe the single minded pursuit of EUV litho is draining investment out of the semi industry that could better be spent elsewhere.
Just as the foundry business consolidated as the costs skyrocketed, now the equipment business will do the same. And just as everyone fears the growth of a single foundry domination to be bad for the industry, they will say the same about this segment. The costs just make any other option impractical, like it or not.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.