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Several drawbacks of this article:
1. Misnomer of calling flipchip as wireless! The latter term is deeply entrenched in mobile communications as is the former term in the chip interconnect industry!! You need to call a spade a spade...
2. Preaching to the choir! Most readers of EE Times are already familiar to flip chip which has been around for decades now. What I would have liked to see is a cross-section of an actual device and not cartoons.
3. Better, quantified data to backup claims made -the authors makes comments about LED arrays but does not show any data to backup. Irrespective of the interconnect method, thermal cross talk between LEDs joined at the substrate is always going to be a problem and I don't see this proven by data.
Blog Make a Frequency Plan Tom Burke 17 comments When designing a printed circuit board, you should develop a frequency plan, something that can be easily overlooked. A frequency plan should be one of your first steps ...