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Several drawbacks of this article:
1. Misnomer of calling flipchip as wireless! The latter term is deeply entrenched in mobile communications as is the former term in the chip interconnect industry!! You need to call a spade a spade...
2. Preaching to the choir! Most readers of EE Times are already familiar to flip chip which has been around for decades now. What I would have liked to see is a cross-section of an actual device and not cartoons.
3. Better, quantified data to backup claims made -the authors makes comments about LED arrays but does not show any data to backup. Irrespective of the interconnect method, thermal cross talk between LEDs joined at the substrate is always going to be a problem and I don't see this proven by data.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.