Is ARM going to put all their eggs into one basket by backing 3D stacking of chips ( SoCs and Memory ) using TSVs ( thru silicon vias ) and wide I//O or would they be open to less disruptive ways to get higher bandwidth / power efficiency for their Core designs aimed at SmartPhones etc. ??
NASA's Orion Flight Software Production Systems Manager Darrel G. Raines joins Planet Analog Editor Steve Taranovich and Embedded.com Editor Max Maxfield to talk about embedded flight software used in Orion Spacecraft, part of NASA's Mars mission. Live radio show and live chat. Get your questions ready.
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