Is ARM going to put all their eggs into one basket by backing 3D stacking of chips ( SoCs and Memory ) using TSVs ( thru silicon vias ) and wide I//O or would they be open to less disruptive ways to get higher bandwidth / power efficiency for their Core designs aimed at SmartPhones etc. ??
As we unveil EE Times’ 2015 Silicon 60 list, journalist & Silicon 60 researcher Peter Clarke hosts a conversation on startups in the electronics industry. Panelists Dan Armbrust (investment firm Silicon Catalyst), Andrew Kau (venture capital firm Walden International), and Stan Boland (successful serial entrepreneur, former CEO of Neul, Icera) join in the live debate.