Is ARM going to put all their eggs into one basket by backing 3D stacking of chips ( SoCs and Memory ) using TSVs ( thru silicon vias ) and wide I//O or would they be open to less disruptive ways to get higher bandwidth / power efficiency for their Core designs aimed at SmartPhones etc. ??
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.