Is ARM going to put all their eggs into one basket by backing 3D stacking of chips ( SoCs and Memory ) using TSVs ( thru silicon vias ) and wide I//O or would they be open to less disruptive ways to get higher bandwidth / power efficiency for their Core designs aimed at SmartPhones etc. ??
Replay available now: A handful of emerging network technologies are competing to be the preferred wide-area connection for the Internet of Things. All claim lower costs and power use than cellular but none have wide deployment yet. Listen in as proponents of leading contenders make their case to be the metro or national IoT network of the future. Rick Merritt, EE Times Silicon Valley Bureau Chief, moderators this discussion. Join in and ask his guests questions.