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Zeev00
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re: ARM TechCon keynote: Move bits not atoms
Zeev00   11/5/2012 5:51:15 AM
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Hmm??

resistion
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re: ARM TechCon keynote: Move bits not atoms
resistion   11/4/2012 11:40:57 AM
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I'm sure 3D helps interconnect side but transistor heat density is definitely higher.

Zeev00
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re: ARM TechCon keynote: Move bits not atoms
Zeev00   11/4/2012 8:17:20 AM
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The biggest problem today is heat extraction from inner layers. Once extracted to the surface, heat removal is no different from today's chips. But since the total system dissipation is significantly reduced from the 2D case, the overall system cooling requirements are reduced for the same design.

krisi
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re: ARM TechCon keynote: Move bits not atoms
krisi   11/3/2012 1:09:22 PM
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thank you Zeev00 for sending IEDM program and pointing to 14.2 paper...looking forward to read that paper

resistion
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re: ARM TechCon keynote: Move bits not atoms
resistion   11/3/2012 9:42:04 AM
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The physics of heat removal requires your conduction path not to heat up. So power line is not the way. You need something like the a/c where heat is extracted from the conduction path itself, by circulating cooling fluid, most simply air. But the power consumption for cooling must then be taken into account.

Zeev00
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re: ARM TechCon keynote: Move bits not atoms
Zeev00   11/3/2012 7:30:43 AM
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Heat extraction may be easier that people imagine. Pay attention the the upcoming IEDM (http://www.his.com/~iedm/program/2012_techprogram.pdf) paper 14.2.

krisi
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re: ARM TechCon keynote: Move bits not atoms
krisi   11/2/2012 3:00:53 PM
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Good point @Zeev00, Feyman predicted that long time ago ("there is plenty of room at the bottom". Again using biological analogy: our brain is a 3D device...but we need to reduce power before going 3D, else there is no way to solve heat extraction problem...reducing computational accuracy, or moving to analog computing (as the brain does) would be useful to accomplish that...Kris

Zeev00
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re: ARM TechCon keynote: Move bits not atoms
Zeev00   11/2/2012 7:26:15 AM
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The only path to systematically reduce power seems to be to go 3D. I am not talking about the TSV 3D path, but the monolithic 3D one. With monolithic 3D integration the interconnects are shorter, and hence their capacitance and power; the off-chip drivers and their large power are gone; and heterogeneous integration saves yet another high-power chip-crossing signalling.

krisi
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re: ARM TechCon keynote: Move bits not atoms
krisi   11/1/2012 5:21:53 PM
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"Approximate data can reduce the computing load significantly. We have to start looking at the way we do computing from a system point of view." - I think is the key takeaway from that talk...our computing is too exact, we calculate everything with 32 or 64 bit accuracy...no need...look at our brains, work much better (pattern recognition for example) despite being much slower

resistion
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re: ARM TechCon keynote: Move bits not atoms
resistion   11/1/2012 10:48:17 AM
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Sometimes it's more efficient for the truck to make the round and pick up some partially full trash bins, rather than make many full bin pickups.



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