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docdivakar
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re: EE Times 40th Anniversary: From 3-D chips to cognitive computing
docdivakar   1/2/2013 6:00:12 PM
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Sorry... guilty of cut & paste... the second para should read: Graphene, on the other hand is REALLY one of those perennially "almost there" technologies! As to its heat spreading...

docdivakar
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re: EE Times 40th Anniversary: From 3-D chips to cognitive computing
docdivakar   1/2/2013 5:59:12 PM
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Nice list... how ever, I object to your statement that "3-D chips are one of those perennially "almost there" technologies..."; they are here NOW! Samsung already introduced a 8Gb version of RDRAM with TSV's. You can expect more product announcements in 2013. Graphene, on the other hand is REALLY the 3-D chips are one of those perennially "almost there" technologies! As to its heat spreading capabilities, there are circuit board technologies available today that use carbon composites for better thermal management (Stablecore for example). MP Divakar



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As data rates begin to move beyond 25 Gbps channels, new problems arise. Getting to 50 Gbps channels might not be possible with the traditional NRZ (2-level) signaling. PAM4 lets data rates double with only a small increase in channel bandwidth by sending two bits per symbol. But, it brings new measurement and analysis problems. Signal integrity sage Ransom Stephens will explain how PAM4 differs from NRZ and what to expect in design, measurement, and signal analysis.

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