Nice list... how ever, I object to your statement that "3-D chips are one of those perennially "almost there" technologies..."; they are here NOW! Samsung already introduced a 8Gb version of RDRAM with TSV's. You can expect more product announcements in 2013.
Graphene, on the other hand is REALLY the 3-D chips are one of those perennially "almost there" technologies! As to its heat spreading capabilities, there are circuit board technologies available today that use carbon composites for better thermal management (Stablecore for example).
Blog Make a Frequency Plan Tom Burke 17 comments When designing a printed circuit board, you should develop a frequency plan, something that can be easily overlooked. A frequency plan should be one of your first steps ...