Nice list... how ever, I object to your statement that "3-D chips are one of those perennially "almost there" technologies..."; they are here NOW! Samsung already introduced a 8Gb version of RDRAM with TSV's. You can expect more product announcements in 2013.
Graphene, on the other hand is REALLY the 3-D chips are one of those perennially "almost there" technologies! As to its heat spreading capabilities, there are circuit board technologies available today that use carbon composites for better thermal management (Stablecore for example).
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.