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Semiguru
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re: SPARC founder: Chip industry sorely needs innovation
Semiguru   11/21/2012 4:59:27 AM
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The USA certainly is in need of more innovators not venture capitalist that milked innovations for their own benefits.

danny1024
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re: SPARC founder: Chip industry sorely needs innovation
danny1024   11/20/2012 2:47:14 AM
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We've been flying around in tubes with wings that are powered by underslung turbofans for 50+ years now. The control surfaces and control interfaces on modern aircraft would be totally recognizable to aviators from 100 years ago. Of course modern aerodynamics and materials science have advanced considerably since that time so innovative designs like Boeing/NASA's X-48c Blended-Wing-Body are now technically possible. The question (as EREBUS implies) is are airports, airlines and passengers willing to take the plunge? It could be that the X-48c is one of those technologies that's always "15 - 20 year in the future." SPARC was never that great of a design and was subsequently crippled by hacks that made it fast for the 80's but hurt its performance long term.

EREBUS0
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re: SPARC founder: Chip industry sorely needs innovation
EREBUS0   11/16/2012 9:06:34 PM
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I am not sure what he means by innovation. The SPARC was not a great innovation, it was a design choice for increasing the speed of computing. As other chips got faster, SPARC could no longer offer a competitive product and they became overtaken by normal speed progressions of hardware. Having a technological advantage is wasted if the user cannot differentiate the value. Being better and faster is no longer a major selection requirement, especially when your networks cannot keep pace with even modest speed devices. Just my opinion.

sranje
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re: SPARC founder: Chip industry sorely needs innovation
sranje   11/16/2012 9:01:45 PM
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LTE smartphones will ultimately offer comparable to WiFi and wired connection speed. This will surely accelerate our entry into an entirely different world -- the "mobile cloud" era - with many new services and - massive technological innovations at component (high frequency, packaging) and system levels



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