somebody in europe will be making a lot of money, but not going to be the fab. At $6B each for a leading edge 300mm fab just to have the big enough capacity scale to make an impact, and Europe wants to build three of them. At 450mm I cant even fathom how much it would cost a fab. The worst part is only two foundries are making money TSMC and SMIC, Its cheaper and get a better return to invest in Airbus.
I doubt these would be state-owned, but rather state-funding facilitated.
Typically the European Commission is prepared to give money to commerical entities for pre-competitive collaborative research projects on a 50:50 basis.
So when Andreas Wild talks about elligible costs he may need to see commercial companies raise a similar amount to that which will come from the EC and national governments.
So IF -- and thats a big IF -- these pilot wafer fabs ever get built or nominated they are likely to be owned by a consortium comprising three or more companies.
That might include the likes of Intel and Globalfoundries although justifying the money gets harder and into political choppy water when inward investors are involved.
The problem is that none of the usual suspects -- Infineon, NXP and STMicroelectronics -- seem that interested in keeping IC manufacturing in Europe.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.