They are already expanding the foundry to have the capability to produce the 450mm wafer and the city just approved the construction of a new 3 story, 565,000sqft manufacturing research center. Combine that with Global Foundries 300,000sqft clean room and that is expanding as well i think they are beefing up quite well.
Albany/capital region New York would be a wise choice for TSMC's next plant. With a region that is 400 years old & deep in industry & innovation from Thomas Edison's lab to the creation of General Electric. Combine that with the high quality of life the region offers, ranging from the beautiful Adirondack mountains where the Olympics were held twice at Lake Placid. To the home of the 4th best engineering school in the world Rensselaer Polytechnic Institute and also the home of Albany College of Nanoscale Science and Engineering which is the leader and pioneer in nanotechnology education, research and economic outreach. Also Albany is known for one of the most highly educated work forces in the world and is located to some of the most unique & innovative cities in the world like New York City, Boston and Montreal.
GF future plan for existing site as I know is 3 fabs, and they have dedicated future fab plan team already. So site selection for new land in Albany is not necessary for GF I think.
Intel, Samsung, and this other company (TSMC) have what seems more real and urgent plan. GF would have to act quick to make it happen in same time but has capability but maybe not money, and preferred plan was fab in middle east (crazy plan but that was where the money was)
Who would have think possible foundry capacity race in US??
unlike state like Texas and California, New York economy is so bad they are just giving huge cash away to Globalfoundries to make their fab. I think same situation for another company...just more business friendly in New York right now. But yes, end result may be intimidating to global
I wondered when this news would hit EE Times. This is big news for USA.
In 2010 there was big rumor that Apple forced Samsung to open logic fab in US to make the exclusive apple sales contract. If apple will move away from samsung in the future, they again may make US manufacturing requirement.
TSMC new fab in US and specifically new york makes a logical choice, but maybe only if Apple is requiring it. Otherwise just make another fab in Taiwan, or elsewhere in Asia for current customer.
Also intel doubling size of D1X fab in Oregon must have some big customer plan...either of these new fab could supply dedicated chip output to apple. And still samsung is making big expansion of their US fab for apple. So it could be 3-way race in US for apple contract between TSMC, Intel and samsung.
Hi Peter - if this plays out, that is, if TSMC does in fact build a fab "next" to GF in upstate NY, this would be the epitome of competitor intimidation. I guess all is fair in "love" and semiconductor customer competition, especially in the foundry business.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.