14XM PDK will be ready as early as Sep '13 (??), MPW in Q1 or Q2 '13 (??), 20nm process was ready but declined to comment commercial HVM running by Marketing&Sales EVP(??). Come on, It does not like normal practice with credit. Peter, you give hard time to Mr. Noonen to tell the truth(bluff).
We should probably rename Intel's 22nm finfet to 28nm as well then? If I recall the ARM ceo was pointing out Intel's 22nm had similar backend to the foundries 28nm node and a 26nm drawn gate dimension.
Bulk FinFET roll ?
I will wait for FinFET on SOI version Mr Noonen
It appears if I watch a moving on Surface Pro using Core i5 (22nm bulk FinFET) vs Surface RT (Arm 40LP)
~10 hour play time on Arm Surface vs 4 hours on a bulk FinFET Surface
Bulk FinFET even included advantage of die shrink to 22nm.
SOI needed for the power savings
I agree. By calling 14XM is a hype. They should call it 20fin something like that. Finfet can't serve all the markets anyway and Intel is tweaking its own 22nm finfet to serve different segements of foundry market.
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