I agree. By calling 14XM is a hype. They should call it 20fin something like that. Finfet can't serve all the markets anyway and Intel is tweaking its own 22nm finfet to serve different segements of foundry market.
no one really cares what you cal it as long as it produces improved power and performance, although perhaps "hybrid" 20/14nm and ""hybrid"" 20/16nm etc might be a fair generic name to use everywhere now
but would using that generic name effect all the web sites adverting income ,probably so it wont happen.
talking about "The first multiproject wafer runs for customers"
hwho are these likely to be BTW, obviously the usual FPGA guy's, but how about XCore and Parallella guy's would they also happen to have some space on these first run's too.
do you happen to have a list of these lesser known companies somewhere that will use these run's ?
Bulk FinFET roll ?
I will wait for FinFET on SOI version Mr Noonen
It appears if I watch a moving on Surface Pro using Core i5 (22nm bulk FinFET) vs Surface RT (Arm 40LP)
~10 hour play time on Arm Surface vs 4 hours on a bulk FinFET Surface
Bulk FinFET even included advantage of die shrink to 22nm.
SOI needed for the power savings
We should probably rename Intel's 22nm finfet to 28nm as well then? If I recall the ARM ceo was pointing out Intel's 22nm had similar backend to the foundries 28nm node and a 26nm drawn gate dimension.
14XM PDK will be ready as early as Sep '13 (??), MPW in Q1 or Q2 '13 (??), 20nm process was ready but declined to comment commercial HVM running by Marketing&Sales EVP(??). Come on, It does not like normal practice with credit. Peter, you give hard time to Mr. Noonen to tell the truth(bluff).
We will see.
No happy ending until the parts are in the field. In my opinion the end customer rules, not the design or lab or prototype folks. I hope the foundry guys have the prototype parts in their phones or cars so they get the field message personally. Motorola used to put engine controller chips in VP cars, if I remember right.
But that was the "IDM" model, like Intel.
@peter.clarke -- interesting piece. Just to be clear, in fully-depleted technologies -- and this is true for SOI & bulk, FD-SOI & FinFET, there are NO floating body effects.
Also re: self-heating, IBM says this is way overblown -- it's an issue for both bulk & SOI. See Ed Nowak's (IBM) piece this week in ASN on Fin-on-Oxide (FinFETs on SOI) -- busts all those myths http://www.advancedsubstratenews.com/2012/11/ibm-why-fin-on-oxide-foxsoi-is-well-positioned-to-deliver-optimal-finfet-value/ .
In the meantime, looking forward to ST's results on 28nm FD-SOI at IEDM next week. These guys are really happy campers!
Wake me up 4 years after a 28nm chip ships from GF; that is when a normal cadence would ship 14nm. I have not seen any 28nm ship, must less 20nm.
I think Oil Daddy will be bailing em out for a while yet.
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