Thanks for the interest Kris. Next-generation NVM is fascinating because of the new technical ground for sure. It did strike me though that there is also quite a bit of jockeying on the corporate side. Paul
Paul-Last one standing? Ignoring niche market applications, the simple answer to your question is the technology that scales lithographically, with of course the need to be competitive in price, performance and reliability with alternative design/device solutions.
I wonder why you did not include Samsung on your diagram, or even the IBM-Hynix PCM tie up, which appears to be focusing on the annular electrode structures as the saving grace for PCM.
Thanks. For sure there is much more going on out there in NVM. The article is really a look at a small slice of this activity, resulting from the Micron/AgigA Press Release crossing my desk. "Last one sitting" ... at writing I was thinking of which relationships hold within this small slice. Finally, I have often found "niche" can be viewed from different angles. A while back I wrote a piece for EETimes that looked at MRAM, PRAM and FRAM. The first two were getting all the attention while FRAM was quietly generating revenue. In the end there is a much bigger discussion here. Paul
FeRAM- should be made with SrBiTaO not PZT. Panasonic sold more than 500 million units
Ramtron stuck to PZT and IBM could not qualify.
High density FeRAM, no. Not below 130 nm because nickel Silicide being the high density metallization cannot take 750 C anneal of 3 minutes.
ReRAM- as long as there is the junk science of filaments, iy is a dog. Look at may first 2011 issue of JAP. I have 3 papers showing not to make NiO with filaments. At IEDM, not one paper referenced this work.
It is amazing!